(Part A. Electronics (ECE
Internet of Things (IOT), Smart Home, Smart Sensors, Smart Grid, Home/Body Area Network (HAN/BAN) Electronic Systems.
Interconnects in VLSI/Nano Systems, Wires in PCBs: Modeling, Delay, Power, Crosstalk, Crosstalk Reduction, Signal/Power Integrity, Test and Testability, CNTs, and Wires in Nano/Bio Electronics.
EMI/EMC, IC Packages, PCB: EMI/EMC in Electronic Systems/PCBs and Optimization, Shielding, Packaging, Susceptibility, Novel Methods/PCBs for EMI Protection, Design and Test based-on EMC Test Standards.
RF and Analog: Components, Circuits, Systems, Phase Arrays, WSNs, Wireless/Wired Transceivers/Communications Systems, Consumer Electronics, Spiral Inductors
VLSI 2D and 3D: High Performance and Low Power IC/ASIC Design/Implementation, Modeling and Optimization for Delay/Energy/Performance, FPGAs, Power Management, CAD Tools for VLSI.
Nano Electronics, Nano ULSI Circuits, Nano Systems, Nano Array-Based Architectures (ABA), Bio-Nano Electronics and Bionics.
Substrate Coupling, Substrate Crosstalk Reduction Techniques, Power Supply Noise.
Part B. Entrepreneurship, Business and Enterprises
Entrepreneurship: Entrepreneurship Eco-System, Corporate Entrepreneurship, Entrepreneurial Orientation/Organization, Innovation Strategies, Entrepreneurial Technology Development and Transfer, New Product Development, Design Thinking, Spin-off Labs (Organization, Towards High-Tech Market Aspects).
Accelerator/Pre-Accelerator and Innovation Centers
Startup, Spinoff, and Enterprise Companies: Design and Engineering, Organization, Management, Commercialization, Market Development.
Science and Technology Parks: Design and Engineering, Process, Organization, Management, Assessment, Incubators.
Knowledge Management: Knowledge Management, Documentation Models/Standards, Competency Based Education and Research
Adviser, Mentoring, Coaching, Entrepreneurship
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